| e79a23c5b9870b7f80425793abeb10e57f7486d4 |
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30-Oct-2013 |
Viresh Kumar <viresh.kumar@linaro.org> |
cpufreq: arm_big_little: add in-kernel switching (IKS) support
This patch adds IKS (In Kernel Switcher) support to cpufreq driver.
This creates a combined freq table for A7-A15 CPU pairs. A7 frequencies
are virtualized and scaled down to half the actual frequencies to
approximate a linear scale across the combined A7+A15 range. When the
requested frequency change crosses the A7-A15 boundary a cluster switch
is invoked.
Based on earlier work from Sudeep KarkadaNagesha.
Signed-off-by: Sudeep KarkadaNagesha <sudeep.karkadanagesha@arm.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Nicolas Pitre <nico@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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| 4521adf85cd18e4652b9285846835f74418bd88f |
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29-Apr-2013 |
Viresh Kumar <viresh.kumar@linaro.org> |
cpufreq: ARM big LITTLE: Move cpu_to_cluster() to arm_big_little.h
The cpu_to_cluster() function may be used by glue drivers, so it's
better to keep it in arm_big_little.h.
[rjw: Changelog]
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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| 8a67f0ef2b684b34162d39e8f436fe39e9635a19 |
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01-Apr-2013 |
Viresh Kumar <viresh.kumar@linaro.org> |
cpufreq: ARM big LITTLE: Add generic cpufreq driver and its DT glue
big LITTLE is ARM's new Architecture focussing power/performance needs of modern
world. More information about big LITTLE can be found here:
http://www.arm.com/products/processors/technologies/biglittleprocessing.php
http://lwn.net/Articles/481055/
In order to keep cpufreq support for all big LITTLE platforms simple/generic,
this patch tries to add a generic cpufreq driver layer for all big LITTLE
platforms.
The driver is divided into two parts:
- Core driver: Generic and shared across all big LITTLE SoC's
- Glue drivers: Per platform drivers providing ops to the core driver
This patch adds in a generic glue driver which would extract information from
Device Tree.
Future SoC's can either reuse the DT glue or write their own depending on the
need.
Signed-off-by: Sudeep KarkadaNagesha <sudeep.karkadanagesha@arm.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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